Material- und produkt-spezifische Applikationen ermöglichen Ihnen, Lösungen mittels Thermischer Analyse für Ihren Arbeitsbereich zu entdecken; wählen Sie aus.
Optimization of the temperature profile for curing of a epoxy-based resin by means of DSC data and kinetic analysis using mulitariate non-linear regression
Determinatioon of thermal conductivity and calculation of thermal diffusivity of amorphous Polycarbonat (PC) and copper fibre reinforced polypropylene (PP)
Determinatioon of thermal conductivity and calculation of thermal diffusivity of amorphous Polycarbonat (PC) and copper fibre reinforced polypropylene (PP)