Application Literature - Thermal Analysis

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Applications Volume Focus on: Thermal Analysis for Polymers

DSC 204 F1 Phoenix® - product brochure

Research, Development and Quality Control of Refractory Materials using Advanced Testing Equipment

STA 449 C Jupiter® - product brochure

TG 209 F3 Tarsus - product brochure

Application Literature

Products / Solutions

Market Segments / Industries

Materials / Applications

Find here applications, ordered by the most important thermoanalytical techniques, please make your selection.

Differential Scanning Calorimetry /
Differential Thermal Analysis - DSC/DTA

Thermogravimetry - TGA

Simultaneous Thermogravimetry -
Differential Scanning Calorimetry - STA (TG-DSC)

Dilatometry / Thermomechanical Analysis / Dynamic-Mechanical Analysis
DIL / TMA / DMA / GST

Dielectric Analysis - DEA

Thermal Diffusivity and Conductivity
LFA / HFM / TCT / GHP

Gas Analysis / Couplings


	AS-101-2006 EP Powder Coating Author: NETZSCH Applications laboratory Investigation of ion viscosity during melting and curing of a powder paint

	AS-124-2006 Polyester Resin on a Mineral Wool Author: NETZSCH Applications laboratory Investigation of the curing behavior of polyester resin as binder of rock wool insolating material

	AS-131-2006 Epoxy Resin Author: NETZSCH Applications laboratory Investigation of the curing reaction of a epoxy resin with both techniques, DSC and DEA

	R-285-06 Cure Monitoring of Paints by Dielectric Analysis - Even in situ Author: S. Knappe The curing behavior of a clear coat, powder paint and liquid acrylic paint is studied by means of DEA paint & coatings industry, september (2005) 26

	R-239-03 Following Cross-linking Author: S. Knappe Optimized paint curing by means of dielectric and kinetik analysis Farbe & Lack, 109 (2003)

	R-238-03 Real-Time UV cure monitoring - dielectric and infrared spectroscopy analyses show close linear correlation Author: K. Zahouily, C. Decker, E. Kaisersberger, M. Gruener Photopolymerization kinetics of UV curable coating systems have been studied by real-time infrared spectroscopy (RT-FTIR) and in situ dielectric analysis (DEA) European Coatings Journal, 11 (2003) 18

	R-228-03 Following the Curing Trail - DEA Author: S. Knappe Correlation of rheology with DEA for an carbon fiber-reinforced epoxy resin NETZSCH-Gerätebau GmbH

	R-280-05 Dielectric analysis of light-curing dental resorative materials - a pilot study Author: M. Rosentritt, M. Behr, S. Knappe, G. Handel Reaction of light curing dental resins investigated by means of DEA published in: Journal of Materials Science (2006)

	AS-164-2007 Polyimide Resin Author: NETZSCH Applications laboratory Curing behavior of a polyimide resin at different temperatures

	AS-150-2007 Powder Coating Author: NETZSCH Applications laboratory Investigation of the ion viscosity during thermal curing of a powder coating

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