Application Literature - Thermal Analysis

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Characterization of PTFE using advanced thermal analysis thechniques

DSC 204 F1 Phoenix® - product brochure

Applications Volume Focus on: Thermal Analysis for Polymers

Videoclip - STA 449 F1 Jupiter®

TG 209 F3 Tarsus - product brochure

Application Literature

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Material and product specific applications allow you to explore thermoanalytical solutions for your specific range of materials; make your selection.

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	R-267-05 Opimization of the curing process of Epoxy-resin-based Casting Compounds using DSC and Kinetic Analysis Author: J. Opfermann, H. Delesky Optimization of the temperature profile for curing of a epoxy-based resin by means of DSC data and kinetic analysis using mulitariate non-linear regression NETZSCH-Gerätebau GmbH

	R-262-04 Thermal Conductivity of the Polymer Melt as Basis Author: S. Knappe Determinatioon of thermal conductivity and calculation of thermal diffusivity of amorphous Polycarbonat (PC) and copper fibre reinforced polypropylene (PP) Kunststoffe plast europe 10 (2004) 1

	R-261-04 From Light Flash to Heat Transfer of Polymers Author: S. Knappe, J. Blumm Determinatioon of thermal conductivity and calculation of thermal diffusivity of copper fibre reinforced polypropylene (PP) NETZSCH-Gerätebau GmbH

	AS-146-2007 Epoxy Powder Coating Author: NETZSCH Applications laboratory Determination of the curing behavior of a epoxy powder coating by means of DSC

	AS-147-2007 Vinyl Ester Resin Author: NETZSCH Applications laboratory Determination of the curing behavior of a vinyl ester resin by means of DMA

	AS-148-2007 Polyethylene (PE-HD) Author: NETZSCH Applications laboratory Oxidation stability of polyethylene (OIT)

	R-239-03 Following Cross-linking Author: S. Knappe Optimized paint curing by means of dielectric and kinetik analysis Farbe & Lack, 109 (2003)

	R-238-03 Real-Time UV cure monitoring - dielectric and infrared spectroscopy analyses show close linear correlation Author: K. Zahouily, C. Decker, E. Kaisersberger, M. Gruener Photopolymerization kinetics of UV curable coating systems have been studied by real-time infrared spectroscopy (RT-FTIR) and in situ dielectric analysis (DEA) European Coatings Journal, 11 (2003) 18

	R-228-03 Following the Curing Trail - DEA Author: S. Knappe Correlation of rheology with DEA for an carbon fiber-reinforced epoxy resin NETZSCH-Gerätebau GmbH

	R-218-02 Measuring Thermal Conductivity Author: J. Blumm Basic theories and applications of different techniques for thermal diffusivity and thermal conductivity Ceramic Industry, June (2002) 53

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