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Thermoelectric Materials

Thermoelectric Materials

To optimize thermoelectric devices, thermal properties must be known. The thermal conductivity has a direct impact on the efficiency of a thermoelectric material.

The thermal stability (analyzed with TGA or DSC) yields information on the maximum service temperature.

STA-MS measurements are ideal for understanding the thermal stability of thermoelectric components.


Differential Scanning Calorimetry (DSC) can be used for the analysis of phase transitions or specific heat.

In thermoelectric research, it is common for the structure to affect the properties, such as electrical conductivity. With a well-designed DSC analysis, researchers can record phase changes occurring during the thermal cycles. The thermal stability and any repeating phase changes are examined with temperature cycling.

Our LFA models carry out fast and reliable thermal conductivity measurements by flash diffusivity methods on small and thin samples across the entire spectrum of possible materials and temperatures.

For the precise measurement of thermal diffusivity, specific heat and thermal conductivity, the LaserFlash technique (LFA) has proven itself as a fast, versatile and exact absolute method.


DIL or DMA methods are used to characterize the thermal expansion and the visco-elastic properties of materials, allowing for the analysis and prediction of thermal stresses in a real device.








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