NETZSCH - Leading Thermal Analysis.    
   
 
 
 

European NETZSCH DEA Seminar
Cure Monitoring of Thermosetting Resins, Paints and Adhesives


Dielectric Analysis (DEA) is an effective method of analyzing the processing and curing behavior of reactive thermosetting resins, composites, adhesives and paints. The method measures the changes in dielectric properties as a function of frequency, time and|or temperature.

With our English-language DEA seminar at the Hotel Friedberger Warte in Frankfurt from June 26th to June 27th, 2007 we will be giving detailed insight into this method and its application.
You are cordially invited to participate!

Detailed information concerning this event are available here.


Below you will find our program as a pdf-download.

Christine Goritzka (training@ngb.netzsch.com) will be happy to help you should you have any questions!

We are looking forward to seeing you!

PDF-Download

 
    print this page back to top back  
 

Thermal Analysis News | Thermal Analysis Products | Thermal Analysis Market Segments | Materials Characterization | Service for Thermal Analysis | Seminars for Thermal Analysis | Applications Measurements | Compliance | Applications Advisory Service | Literature Data Base | Proteus Software | Advanced Software | Contact | NETZSCH worldwide | History | DSC Analysis | TG Analysis | TG-DSC Analysis (STA) | QMS / FTIR Analysis | DIL / TMA / DMA | DEA | LFA / HFM / TCT | RUL / HMOR / PCE / TCT | Sitemap | Imprint

NETZSCH Group | NETZSCH Grinding & Dispersing | NETZSCH Pumps | NETZSCH Oilfield Products