New Accessories for the DEA: Furnace and Press

Dielectric Analysis (DEA) is enjoying an increase in popularity as a means of examining the curing behavior of reactive resin systems. Unlike conventional Thermal Analysis, it can be used not only in the laboratory but also during the process itself, i.e. in-situ.

Particularly for the development of new paint or adhesive formulations, however, it is desirable to simulate practical conditions already on a laboratory scale. For this purpose, available immediately, we offer a small, simple-to-operate collapsible furnace with an integrated sample thermocouple that can be controlled using the Eumetric software of the DEA 230/X Epsilon or manually (for the DEA 231/1 Epsilon). Temperature ramps can be programmed with heating rates of up to 40 K/min for curing up to a maximum of 375°C. Any commercial comb sensor (e.g. IDEX, MS, Chip) can be placed into the new DEA furnace.


For the compression of prepregs or SMC/BMC we also offer, available immediately, a pneumatic, water-cooled press that delivers a force capacity of 10 kN at a pressure of 5 bar. Test molds up to a diameter of 165 mm with an integrated TMS or monotrode sensor can be positioned therein. The press can also be controlled either using the Eumetric software of the DEA 230/X Epsilon or manually (for DEA 231/1 Epsilon) for temperature ramps up to a maximum of 300°C.