Thermomechanical analysis in the polymer sector

TMA 202 - Thermomechanical Analyzer

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Epoxy Resin EP
This figure depicts the thermal expansion behavior of an EP-based bonding film, characterized by the expansion curve (green) and its derivative with respect to time (red). Softening of the 30 µm-thick sheet, measured in the tension mode, begins at 97°C (load: 2 cN; heating rate: 10 K/min). The expansion behavior of the bonding film must be matched to that of the substrate. The technical expansion coefficients (alpha values) determined are used for this purpose.

Polyethyleneterephthalate PET
The dimensional stability of molded parts is very important for the plastics processor and the user as well. If a finished part is not stable after processing because the cycling time was too short, the dimensional changes that occur during post-crystallization can distort the molded part, rendering it useless. This is true especially for semicrystalline thermoplastics that crystallize relatively slowly, like the PET investigated here. During the second heating of the PET, after cooling slowly, no drastic dimensional change is recorded until the onset of melting. The second heating was displayed with the starting point shifted to that of the first heating. A heating rate of 5 K/min was selected in each case.

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