NETZSCH - Leading Thermal Analysis.   Leading Thermal Analysis  
   
 
 
 

Monitor for fast curing processes online.

DEA 231 Epsilon – Dielectric Analyzer

 
GeneralTechniqueSoftwareApplicationsAccessoriesLiterature 

Info & Service:

Product Information
Would you like to request more information on a particular product?
We will be happy to send you what you need.
Continue

Service Information
Find out more about our various service offerings.
We are at your assistance!
Continue

Screen Dump for the quality assurance of a SMC

Production Monitoring of a polyimide prepreg
The molding of a polyimide/graphite prepreg in a production press was automated using the ion viscosity to initiate processing steps. Pressure was applied when the ion viscosity detected the viscosity minimum of the material, the critical time when the resin would flow properly but the excess volatiles would not be trapped. An additional critical point was employed to trigger de-mold when the part was sufficiently cured, thus reducing cycle times and increasing throughput. This is reflected in a much lower price for the molding.

 

GeneralTechniqueSoftwareApplicationsAccessoriesLiterature 

Please also visit the following product pages:

DMA 242 C

DMA 242 C


DEA 230 Epsilon Series

DEA 230 Epsilon Series


 
    print this page back to top back  
 

Thermal Analysis News | Thermal Analysis Products | Thermal Analysis Market Segments | Materials Characterization | Service for Thermal Analysis | Seminars for Thermal Analysis | Applications Measurements | Compliance | Applications Advisory Service | Media Service | Proteus Software | Advanced Software | Contact | NETZSCH worldwide | History | DSC Analysis | Multiple Mode Calorimetry (MMC) | TGA Analysis | TG-DSC Analysis (STA) | QMS / FTIR / TG-GC-MS Analysis | DIL | TMA | DMA / DMTA | Adiabatic Reaction Calorimetry | DEA | LFA / GHP / HFM / TCT | RUL / HMOR / PCE / TCT | Sitemap | Imprint

NETZSCH Group | NETZSCH Grinding & Dispersing | NETZSCH Pumps