Littérature d’applications - Analyse Thermique

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Polyimide Resin

Epoxy Powder Coating

Applications Volume Focus on: Thermal Analysis for Polymers

Polytetrafluoroethylene (PTFE)

Applications Volume Focus on: Thermal Analysis for Paints

Littérature d’applications

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Des applications spécifiques pour différents secteurs d’industrie et de recherche sont rassemblées ici, merci de sélectionner votre secteur d’activité.

Recherche / Développement, Université

Elaboration et Production de polymères

Industries Pharmaceutique, Alimentaire et Cosmétique

Industrie Chimique

Industrie des moyens de transport

Industrie Electronique

Industrie Métallurgique

Industrie Céramique, Verre, Matériaux de construction


	AS-134-2006 PET/PC Blend Auteur: NETZSCH Applications laboratory Separation of glass transition and cold crystallization by means of modulated DSC

	AS-136-2007 Polymethyl methacrylate (PMMA) Auteur: NETZSCH Applications laboratory Decomposition behavior of PMMA and identification of the released gases by means of TG-FTIR

	AS-137-2007 Polyoxymethylene (POM) Auteur: NETZSCH Applications laboratory Decomposition behavior of POM and identification of the released gases by means of TG-FTIR

	AS-138-2007 Polyenthylene (PE) Auteur: NETZSCH Applications laboratory Decomposition behavior of PE and identification of the released gases by means of TG-FTIR

	AS-140-2007 Vinyl Ester Resin Auteur: NETZSCH Applications laboratory Investigation of the curing reaction of vinyl ester resin by means of DSC with kinetic evaluation

	AS-141-2007 NaHCO₃ Auteur: NETZSCH Applications laboratory Decomposition behavior of NaHCO₃ and identification of the released gases by means of TG-FTIR

	AS-145-2007 Epoxy Resin Auteur: NETZSCH Applications laboratory Determination of the curing behavior of a epoxy resin by means of DSC

	R-285-06 Cure Monitoring of Paints by Dielectric Analysis - Even in situ Auteur: S. Knappe The curing behavior of a clear coat, powder paint and liquid acrylic paint is studied by means of DEA paint & coatings industry, september (2005) 26

	R-267-05 Opimization of the curing process of Epoxy-resin-based Casting Compounds using DSC and Kinetic Analysis Auteur: J. Opfermann, H. Delesky Optimization of the temperature profile for curing of a epoxy-based resin by means of DSC data and kinetic analysis using mulitariate non-linear regression NETZSCH-Gerätebau GmbH

	R-262-04 Thermal Conductivity of the Polymer Melt as Basis Auteur: S. Knappe Determinatioon of thermal conductivity and calculation of thermal diffusivity of amorphous Polycarbonat (PC) and copper fibre reinforced polypropylene (PP) Kunststoffe plast europe 10 (2004) 1

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