This extensive program delves deeply into instrumental methods and applications for thermal analysis and measurement of thermophysical properties including DSC, TGA, STA (Simultaneous DSC/DTA-TGA), Laser Flash for Thermal Diffusivity and Thermal Conductivity, as well as Dilatometry for thermal expansion. These are excellent tools for answering critical questions in the areas of product development, quality control & assurance, failure analysis and research of new products & materials. Several of these methods are found to be even more powerful when combined with other techniques for evolved gas analysis such as FTIR, MS, and GC-MS. The goal of this seminar is to more deeply examine the capabilities of these methods with real life applications from the fields of thermoplastics, thermosets, metals, ceramics, and other advanced materials. Customer presentations are invited.

People working in research, development, processing or quality control who wish to familiarize themselves on a more detailed level with the uses of thermal analysis and thermal properties measurement for advanced materials characterization.

Please take a look at our seminar program.


Lecturers:

Experts from NETZSCH 

• May 10, 2012 - Saint Paul, Minnesota (Embassy Suites St. Paul - Downtown, 175 East 10th Street)
• June 20, 2012 - Edison, New Jersey (Sheraton Edison Hotel-Raritan Center, 125 Raritan Center Parkway)