Delamination (Time to Delamination)

Delamination refers to the separation of layers from one another – e.g., of a resin from a laminate or of fibers from a resin. Such processes cause defects in printed circuit boards.

ICP-TM-650 No. 2.4.24.1 describes the method of determining the time to delamination for laminates and printed boards through the use of a thermomechanical analyzer (TMA).

The sample is heated to a specified isothermal temperature at 10 K/min and is then held at this temperature for 10 minutes or until failure (see figure 1).

Figure 1: Typical scan of an epoxy material at 260°C (taken from ICP-TM-650 No. 2.4.24.1)

Related Methods

TMA