This technical seminar will delve deeply into the most important methods for thermal analysis and measurement of thermophysical properties including DSC, TGA, STA (Simultaneous DSC/DTA/TGA), Laser Flash for Thermal Diffusivity and Thermal Conductivity, Seebeck Coefficient measurements, as well as Dilatometry for thermal expansion.
These versatile techniques are excellent tools for answering critical questions in the areas of product development, quality control & assurance, failure analysis and research of new products & materials. Measurement theory, instrument design, and practical applications will be detailed.
Additional focus will be on the newest Laser Flash, Dilatometers and Seebeck Coefficient instruments as well as their applications to thermoelectric materials research and their performance.
The goal of this seminar is to demonstrate the capability of these thermoanalytical methods with real life pplications from the fields of thermoplastics, thermosets, metals, ceramics, and other advanced materials.
|9.00||Arrival and Continental Breakfast|
|9.15||Welcome and Introduction to NETZSCH Instruments|
|9.30||Introduction of Classical Thermal Analysis Methods – DSC, TGA and Simultaneous TGA-DSC/DTA|
|10.45||Introduction of Evolved Gas Coupling Methods including mass spectrometry, FT-IR and GC-MS|
|11.30||Thermophysical Properties Measurements: Specific Heat Measurements and Laser Flash Thermal Conductivity/Diffusivity Measurements|
|12.15||Stationary Methods for Thermal Conductivity Tests on Insulations: Heat Flow Meter Method|
|1.30||Introduction to Thermomechanical Properties: Dilatometry (DIL), Thermomechanical Analysis (TMA) and Dynamic Mechanical Analysis (DMA)|
|2.10||Cure Monitoring of Thermosetting Resins by Dielectric Analysis (DEA)|
|2.30||Humidity and Water Vapor Measurements for Thermal Analysis|
|3.00||Wrap Up and Final Discussions|