Advanced Thermal Analysis and Applications

Program

Your device is too small to show this table.
8.00-8.30Registration
8.30-8.45

Short Company Introduction
New Products & Unique Technical Solutions Overview

8.45-10.00

Unique DSC Solution for Polymer/Composites & Pharma Applications
Kinetics NEO Software

Thermogravimetry (TGA) & Simultaneous TGA/DSC for Polymers, Pharma, High-Tech Ceramics, Building Materials, Metals and Alloys

10.00-10.30Break
10.30-12.00

Evolved Gas Analysis (GC-MS/QMS/FT-IR)

Dynamic Mechanical Analysis (DMA) for Polymer, Composites and Rubber

Unique High Force DMTA (Hot Moduls) for Ceramics, Glass and Metals

12.00-12.45Lunch
12.45-14.00Thermal Conductivity, Electrical Conductivity, CTE and Seebeck Coefficient - Suitable Applications
14.00-14.30Questions

 

 

Registration

The seminar is free of charge.

In case of cancellation of registered participation, we will have to charge for already pre-booked food and beverages.