Characterising and optimising the curing of thermosetting resins and composite materials

Date Note City Country
31 Jan 2018 Deakin University Geelong Australia Register
02 Feb 2018 University of Queensland Brisbane Australia Register
07 Feb 2018 University of Auckland Auckland New Zealand Register

Content

This workshop will focus on thermal characterisation techniques for characterising and optimising the curing of thermosetting resins, composite materials, paints and inks. The theory of the thermal stability, composition of materials, enthalpy changes, specific heat, transition energetics, and deformation will be covered. Both the advantages and limitations of the various measurement techniques including DSC, TGA, DMA, TMA, and DEA will be discussed. Characterisation using UV light and evolved gas analysis (EGA) coupled to standard thermal analysis techniques such as TGA and DSC will also be covered. Finally, a live demonstration of the DEA 288 Epsilon and a facility tour will conclude the workshop.

Target Group

Scientists, engineers, and laboratory personnel working in research, development, processing or quality control who wish to familiarise themselves with the latest developments in the area of thermal analysis and thermal property measurements for characterisation of the curing process with thermosetting resins, polymers composites and coatings.

Registration

Please register before Friday, January 19

Program

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09:00Registration
09:15Welcome and Introduction to NETZSCH Analyzing & Testing
09:30DSC 214 Polyma – Ideal for R&D and QC for Polymers, especially the Curing of Thermosetting Resins
10:15Thermal and UV Curing of Thermosets, Adhesives & Paints by DSC and Thermokinetic Analysis
10:45Break
11:15TG 209 F1 Libra – Advanced Thermogravimetric Analysis (TGA)
11:45TGA Coupled to FT-IR for the Curing of Thermosetting Resins
12:15Lunch
13:15Thermomechanical and Dynamic Mechanical Analysis on Thermosets and Composites (TMA 402 F1/F3 Hyperion / DMA 242 E Artemis / DMA EPLEXOR)
14:15Cure Monitoring of Thermosetting Resins by Dielectric Analysis (DEA) + LIVE Demonstration of the Curing of a 2C Epoxy Resin with DEA 288 Epsilon
15:30Final Questions & Answers
15.45Facility Tour (optional)
16:30End

Venues

University of Auckland
Newmarket Campus
Gate 3, 368 Khyber Pass Road
Auckland, New Zealand
Location: Room 902.402

Transport Information

 

University of Queensland
St Lucia Campus
Brisbane, Queensland
Location: Building 49 (Advanced Engineering Building), Room 502

Transport information

 

Deakin University
Waurn Ponds Campus
75 Pigdons Rd
Waurn Ponds, Geelong, Victoria
Location: Building Na, Room 1.417

Transport information

Workshop Presenters

Stephan Knappe
International Sales & Applications Manager
NETZSCH Gerätebau GmbH, Selb, Germany

Andrew Gillen
National Product Manager
NETZSCH Australia Pty Ltd

Presenter Biographies

Participation Fee

FREE*
(includes lunch and morning tea)

Should you have any further questions, please do not hesitate to contact Andrew Gillen by phone (+ 61 408 075 956) or e-mail ( andrew.gillen‎@‎netzsch.com).

 

* This event is run free of charge, including catering; attendees should confirm via email (at.au@netzsch.com) if there are any special dietary requirements. Should you register and not attend (without providing 48 hours notice), at our discretion, we may charge a fee of $80 per day to cover workshop and catering requirements. This policy will ensure greatest capacity at the workshop and allow others on the waiting list to have the opportunity to attend.