熱電材料

The thermal stability (analyzed with TGA or DSC) yields information on the maximum service temperature.

STA-MS measurements are ideal for understanding the thermal stability of thermoelectric components.

Differential Scanning Calorimetry (DSC) can be used for the analysis of phase transitions or specific heat.

Our LFA models carry out fast and reliable thermal conductivity measurements by flash diffusivity methods on small and thin samples across the entire spectrum of possible materials and temperatures.

For the precise measurement of thermal diffusivity, specific heat and thermal conductivity, the LaserFlash technique (LFA) has proven itself as a fast, versatile and exact absolute method.

DIL or DMA methods are used to characterize the thermal expansion and the visco-elastic properties of materials, allowing for the analysis and prediction of thermal stresses in a real device.