Delamination refers to the separation of layers from one another – e.g., of a resin from a laminate or of fibers from a resin. Such processes cause defects in printed circuit boards.
ICP-TM-650 No. 184.108.40.206 describes the method of determining the time to delamination for laminates and printed boards through the use of a thermomechanical analyzer (TMA).
The sample is heated to a specified isothermal temperature at 10 K/min and is then held at this temperature for 10 minutes or until failure (see figure 1).