This technical seminar will delve deeply into the most important methods for thermal analysis and measurement of thermophysical properties including DSC, TGA, STA (Simultaneous DSC/DTA/TGA), Laser Flash for Thermal Diffusivity and Thermal Conductivity, Seebeck Coefficient measurements, as well as Dilatometry for thermal expansion.
These versatile techniques are excellent tools for answering critical questions in the areas of product development, quality control & assurance, failure analysis and research of new products & materials. Measurement theory, instrument design, and practical applications will be detailed.
Additional focus will be on the newest Laser Flash, Dilatometers and Seebeck Coefficient instruments as well as their applications to thermoelectric materials research and their performance.
The goal of this seminar is to demonstrate the capability of these thermoanalytical methods with real life pplications from the fields of thermoplastics, thermosets, metals, ceramics, and other advanced materials.
|8.45 AM||Arrival & Continental Breakfast|
|9.15 AM||Welcome & Introduction to NETZSCH|
|9.30 AM||Introduction to TGA, DSC and Simultaneous DSC/TGA for Research, Quality Control and Failure Analysis|
|10.50 AM||Hyphenated Techniques for Evolved Gas Coupling Methods: FT-IR, QMS and GC-MS|
|11.30 AM||Application Examples: Thermal Analysis and Evolved Gas Analysis of Polymers and Ceramics|
|12.10 AM||Live DSC 214 Polyma and TG 209 F1 Libra with compact FT-IR including SmartMode and AutoEvaluation Software Demonstrations|
|1.30 PM||Introduction to Thermophysical Properties Measurements Techniques: Specific Heat, Thermal Conductivity and Thermal Diffusivity|
|2.40 PM||Thermal Expansion Methods: DMA, TMA and Dilatometry|
|3.30 PM||Wrap Up & Final Discussion|