Silicon wafer — Thermophysical Properties

In this example, the thermophysical properties of a silicon wafer were measured with the LFA 457 MicroFlash®. In the temperature range from -100°C to 500°C, the thermal conductivity and thermal diffusivity continuously decrease.
Determination of the specific heat was carried out with the DSC 204 F1 Phoenix®. The standard deviation of the data points is < 1%.

LFA and DSC measurement of a silicon wafer between -100°C and 500°C.LFA and DSC measurement of a silicon wafer between -100°C and 500°C.
DSC 204 F1 Phoenix®

Very high sensitivity and resolution can be realized with this premium Differential Scanning Calorimeter (DSC), which also features an automatic sample changer (ASC), temperature modulation (TM-DSC), baseline optimization (BeFlat®), correction of thermal resistance and time constants (DSC-correction), even coupling to QMS and FTIR as well as UV-extension for photo-calorimetry.

LFA 457 MicroFlash® - Laser Flash Apparatus

The LFA 457 MicroFlash® is the most modern product for the determination of the two thermophysical properties, thermal diffusivity and conductivity, in the range from -125°C to 1100°C. Its compact, vacuum-tight construction, automatic sample changer and functional software guarantee the highest effectiveness for challenging materials testing.