Pure Copper – Thermal Diffusivity

The thermal diffusivity of pure copper was measured for both the heating and cooling cycles. The large change in the thermal diffusivity at approximately 1080°C is due primarily to the change in the electronic component of the thermal conductivity upon melting or solidification. The fact that there is almost no difference in the thermal diffusivity values between the heating and cooling cycles indicates that no significant micorstructural changes occured. The measured values of the thermal diffusivity for both the solid and liquid regions deviated from those found in the literature by less than 2.5%. Note that the change in thermal diffusivity provides a good temperature calibration point for the LFA (melting point of pure copper = 1083°C). (measurement with LFA 427)

LFA 427 - Laser Flash Apparatus / Pyrometer version for up to 2800°C

Outstanding attributes of the LFA 427 are high precision and reproducibility, short measuring times, variable sample holders and precisely adjustable atmosphere conditions in the application range from -120°C to 2800°C. The LFA 427 is the most powerful LFA system for use in research & development.